This report provides a comprehensive analysis of the Nokia Networks 5G AirScale Digital Baseband Unit (BBU). The configuration of the 5G AirScale is:

AMIA Subrack

ASIK Common Plug In Unit

ABIL Capacity Plug In Unit

Features

System Functional Description

System Level Block Diagrams

High Level Mechanical Analysis

Heat Sink

High Level PCB Analysis

Component Diagrams

Semiconductor/component locations on PCB

High Level Bill of Materials

Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)

Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)

Complete Part Number/Marking

Component Manufacturer Identification

Function Component Description

Package Type

Excludes analysis of low power passive chip resistors, capacitors, and inductors

CHAPTER 1: AMIA SUBRACK

AMIA Guiderails

ASIx Blind Slot Frame

ABIx Blind Slot Frame

AMIA Chassis: External Views and Dimensions

AMIA Chassis: Backplane and Fan Units

AMIA Backplane

CHAPTER 2: ASIK PLUG IN UNIT

ASIK Front Panel & Handles

Power Supply Unit (PSU)

PSU Top Cover Heatsink

PSU Bottom FCTL Heatsink

PSU Printed Circuit Board Analysis

PSU Input DC Voltage Connector Assembly

PSU DC Busbar Assembly

ASIK FCTL PCB

eUSB Flash Card

OCXO Module

ASIK FCTL Bottom Cover

CHAPTER 3: ABIL

ABIL Front Panel

ABIL ASPA Heatsink

ABIL ASPA Cover

ABIL ASPA PCB

AirScale System Module

This baseband module is designed to be agile and enable long-term network evolution. The in-node modularity of the AirScale System Module is key to lean entry and decoupled scalability of the compute power for radio access network layers 1, 2, and 3 and integrated transport functionality – essential for the rapidly changing traffic requirements of new use cases and deployment scenarios of the 5G era.

The AirScale System Module simplifies 2G, 3G, 4G and 5G Single RAN deployments, streamlines multi-band sites and powers multi-site baseband hotels.